NOTE: This message is being posted for subscriber Wolfgang Herbst
([log in to unmask]), who is experiencing technical difficulties. Send replies
to the forum or to his address, not [log in to unmask] Thanks.
---------------------------------------------
Hi,
I heard about materials which combine flux and underfill for Flip-Chip applications.
I would appreciate if someone can recommend the suppliers (contact address) and give
some information about advantages and disadvantages (or experience?) with these
materials.
Thank you very much !!!
Wolfgang Herbst
[log in to unmask]
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