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August 1998

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Subject:
Gold & Wire Bond -Reply
From:
Mike Lang <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Mike Lang" <[log in to unmask]>
Date:
Fri, 21 Aug 1998 08:11:03 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (52 lines) 
Plasma Etch

Thanks,

Lang
x5046

>>> <[log in to unmask]> 08/20/98 07:24pm >>>
With all the expertise out there, what is the best way
to clean up type III gold at 100 microinches that has
"dirty" and/or "smutty" looking gold which will not take
wire bond @ .001 wire ????
thanx...

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