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August 1998

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Subject:
From:
Charles Barker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 20 Aug 1998 20:03:26 -0500
Content-Type:
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Hi there fellow Techies!
     I need some advice/suggstions please. We need to attach a custom
leadless ceramic device to a board. The device is about .5" square with
rounded off corners and has .025" pitch gold solder to pads on the bottom
side only. The attachment surface does not run up the side of the device in
the fashion of a normal castellation found on regular leadless ceramic
packages.  These pads are .016 x .042 by about .002" thick.
     The boards are hasl finished. The pads on the board are .016" x .053".
The first attempt at soldering these was made using a .006" thick stencil.
That produced all leads shorted together. The next run was with a .004"
thick setncil. We still experienced some bridging.
     Have any of you worked with such a device and/or do you have any
suggestions on the most reliable way to solder such a critter to a board?

Thanks in advance!

Charlie Barker
[log in to unmask]
281-552-3328

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