Subject: | |
From: | |
Reply To: | Leslie O. Connally |
Date: | Thu, 20 Aug 1998 14:49:12 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
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Hi Marcelo,
Perhaps some more information is needed. Do you want to evaluate bare boards,
or populated boards ? Do you want to do air to air or liquid to liquid thermal
cycling ? We have done both and do bare boards routinely. In the past we have
monitored populated boards with K-factor Chips mounted in the Chip carriers.
Indeed it is possible to monitor insitu and only report the occurrences of
failures, with the proper datalogger. I could be more help off line if you
desire to contact me by E-mail directly.
Regards,
Les Connally
> From: "Chan, Marcelo" <[log in to unmask]>, on 8/20/98 3:08 PM:
> I would like to know if it is possible these days to conduct reliability
> tests
> on daisy chain components and monitor < 2 Ohms resistance change rather than
> just continuity... I understand that I could utilize the four probe
> resistance
> approach, but I would like to monitor about 100 devices simultaneously...I
> am
> looking manageable approaches for upgrading our current continuity
> approach....
> Also, how do people overcome the data logging of intermittent failures
> without
> causing a tremendous amount of data.... on one hand, we want to capture an
> open
> during temperature cycling, but not log the same device over and over again
> in a
> span of 1 second....
>
> Thanks,
>
> Marcelo
>
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