Hi Marcelo,

 Perhaps some more information is needed. Do you want to evaluate bare boards,
or populated boards ? Do you want to do air to air or liquid to liquid thermal
cycling ? We have done both and do bare boards routinely. In the past we have
monitored populated boards with K-factor Chips mounted in the Chip carriers.
Indeed it is possible to monitor insitu and only report the occurrences of
failures, with the proper datalogger. I could be more help off line if you
desire to contact me by E-mail directly.

Regards,
Les Connally
>  From: "Chan, Marcelo" <[log in to unmask]>, on 8/20/98 3:08 PM:
>  I would like to know if it is possible these days to conduct reliability
>  tests
>  on daisy chain components and monitor < 2 Ohms resistance change rather than
>  just continuity... I understand that I could utilize the four probe
>  resistance
>  approach, but I would like to monitor about 100 devices simultaneously...I
>  am
>  looking manageable approaches for upgrading our current continuity
>  approach....
>  Also, how do people overcome the data logging of intermittent failures
>  without
>  causing a tremendous amount of data.... on one hand, we want to capture an
>  open
>  during temperature cycling, but not log the same device over and over again
>  in a
>  span of 1 second....
>
>  Thanks,
>
>  Marcelo
>
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