You may try to get a hold of a paper by Robert Kotlowitz. At the time he was
with Bell Labs in Whippany, NJ. It is titled "Comparative Compliance of
Generic Lead Designs for Surface Mounted Components" Published in the IEPS
Journal Vol 10, no. 1  - I don't have a more specific date, sorry. -  I
think it was in 1988 or 1989. It was presented at their 8th annual
conference.

> -----Original Message-----
> From: Mike Lang [SMTP:[log in to unmask]]
> Sent: Wednesday, August 19, 1998 7:00 AM
> To:   [log in to unmask]
> Subject:      [TN] Bending Stress on SMT Devices
>
> I am in the process of converting a PCB from Through Hole to
> SMT.  Of particular concern  is the fact that in use, the board
> is held along its edges while a connector is plugged into the
> PCB.  I am concerned about PCB deflection which will result
> in stress to the SMT components and solder joints, causing
> hard and/or latent defects.
>
> Can anyone supply the following information:
>
> 1) "Allowable" PCB deflection for SMT design, maybe a
> radius of curvature...  (I know that each design must be
> qualified due to different parts, processes, etc, but is there a
> guideline?)
>
> 2) A good test (method as well as what to measure and what
> to do with the data) for determining susceptibility to this type
> of stress?
>
> 3) Literature on the subject?
>
> Someone has done this already!
>
> Thanks,
>
> Mike
>
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