I am in the process of converting a PCB from Through Hole to
SMT.  Of particular concern  is the fact that in use, the board
is held along its edges while a connector is plugged into the
PCB.  I am concerned about PCB deflection which will result
in stress to the SMT components and solder joints, causing
hard and/or latent defects.

Can anyone supply the following information:

1) "Allowable" PCB deflection for SMT design, maybe a
radius of curvature...  (I know that each design must be
qualified due to different parts, processes, etc, but is there a
guideline?)

2) A good test (method as well as what to measure and what
to do with the data) for determining susceptibility to this type
of stress?

3) Literature on the subject?

Someone has done this already!

Thanks,

Mike

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