Contact IPC and obtain:

"Wirebondability and solderability of various metallic finishes for use in
printed circuit assembly." by Hillman, Bratin and Pavlov (1996 IPC Printed
Circuits Expo, San Jose, CA.

Regards,
Lenny Kurup
EMX Enterprises Ltd.
Markham, Ontario, Canada
[log in to unmask]


On Mon, 17 Aug 1998 [log in to unmask] wrote:

> Dear TechNet members
>
> I know that electroless nickel/immersion gold finish is Al wire
> bondable. But I need some publications to support it. Does anyone out
> there know any publications regarding this?
> Thanks in advance.
> suixin zhang
> ELIS-TFCG/IMEC, University of Ghent
> Sint-Pietersnieuwstraat 41, B-9000 Ghent, Belgium
> tel: 0032-9-2643404
> fax: 0032-9-2643594
> Email: [log in to unmask]
> http://www.elis.rug.ac.be/ELISgroups/tfcg/staff/sz.html
>
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