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Subject:	Re: Clean Room Requirements for die attach, wire bonding, and encapsulation
From:	Joseph Fjelstad <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 4 Aug 1998 11:48:42 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (51 lines)

Gerry,

There are a lot of contract IC assemblers out there looking for work in
ezactly this area and in this rather soft market. They could well be able
to meet your production needs. You may wish to look closely at the make/buy
issues before you make such an investment.

Kind regards
J. Fjelstad

At 11:28 PM 7/19/98 -0700, you wrote:
>My company is expanding its PCB capability to include die attach, wire
>bonding and encapsulation.  We plan to setup a clean room to house all
>of this equipment.  Could someone give me advice on clean room
>requirements for these operations?
>
>Clean Room Class: 100  1,000  10,000 ?
>Temperature control: target and range
>Humidity control: target and range
>Apparel required: (shoe covers, bouffants, gloves, jackets...)
>Is an air shower in the entry way required?
>
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