Dennis (and others) if I may ask, why do you want to put this mix in your
reflow oven.  What assembly process/technolgy is this used for?  I asked a
question on technet several months ago about using nitrogen/hydrogen in the
reflow process, because I was told that the hydrogen, at temperatures above
300C (or 350C from another source) will actually clean the surface of an
area to be soldered, thus eliminating flux.  Obviously at this temperature,
you would need a high temp solder, and components that can withstand the
high temperatures.  Curious minds want to know, who is using this, and why?
It is my understanding that Electrovert has investigated this, but my
contact person did not say much.  I think they are still investigating.

CURIOUS MINDS WANT TO KNOW!!!!!!!!!!!!!




[log in to unmask] on 08/17/98 02:39:36 PM

Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Ed Holton/Hella North America Inc.)
Subject:  [TN] Hydrogen/Nitrogen saftey issues




From: Dennis J Fall@TFT on 08/17/98 01:39 PM


To:   [log in to unmask]
cc:
Subject:  Hydrogen/Nitrogen saftey issues

I am looking for some information regarding the safety of reflow ovens
using a 15% Hydrogen 85% Nitrogen atmosphere.  If anyone has had experience
using this concentration or something close to it, please let me know.
Maybe we can discuss any safety issues that may pertain to the process.

Thank You,

Dennis Fall                        P: 507-625-8445 x17

Process Engineer                   F: 507-625-3523

Thin Film Technology Corporation         mailto:[log in to unmask]

1980 Commerce Drive                http://www.thin-film.com

North Mankato, MN 56003-1702

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
 text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information. For technical support contact Hugo Scaramuzza
at [log in to unmask] or 847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################