There is mil-std-883b spec for cleanroom and facilities requirements and
monitoring(I don't know no). Normally, the standard requirement is
Class1000 to class 10000 for env. till die is exposed to ambience. Class
100,000 to higher for corridors. Air shower at main entrance should be
fine. in case class1000 is used(for high rel hermetic packages) ,
provide separate air shower to entrance room.Normally temp reqd as 21-23
deg C , Humidity 40-55 % RH.Use ESD safe smokes for assy
operations.overall smoke including smoke, headgear, shoes cover and
gloves .Air particle counter and wet and dry bulb thermometer.
 hope this may help.

Ashok Dhawan P.ENG.
Manufacturing Engineering
Unisys Canada Inc.
51 Burmac Road
Winnipeg R2J4C9
CANADA
Fone 204-257-9199
Fax   204-257-9104




> ----------
> From:         Gerry Glatz[SMTP:[log in to unmask]]
> Sent:         July 20, 1998 1:28 AM
> To:   [log in to unmask]
> Subject:      [TN] Clean Room Requirements for die attach, wire
> bonding, and encapsulation
>
> My company is expanding its PCB capability to include die attach, wire
> bonding and encapsulation.  We plan to setup a clean room to house all
> of this equipment.  Could someone give me advice on clean room
> requirements for these operations?
>
> Clean Room Class: 100  1,000  10,000 ?
> Temperature control: target and range
> Humidity control: target and range
> Apparel required: (shoe covers, bouffants, gloves, jackets...)
> Is an air shower in the entry way required?
>
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