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August 1998

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Subject:
From:
"Meschter, Stephan J" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "Meschter, Stephan J" <[log in to unmask]>
Date:
Sat, 15 Aug 1998 11:38:22 -0400
Content-Type:
text/plain
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text/plain (66 lines)
The best way that I can think of is to use microvia technology. Put a
microvia in the BGA solderpad
and move the "dogbone" to layer 2 where it won't be a problem.
Steph

*********************************************************
Stephan Meschter               [log in to unmask]
Lockheed Martin Control Systems  Phone  :(607)770-2332
600 Main Street, MD R52F         FAX    :(607)770-2056
Johnson City, NY 13790-1888      MARCALL: 8 * 255-2332
*********************************************************


> ----------
> From:         [log in to unmask][SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> Sent:         Thursday, August 13, 1998 5:49 PM
> To:   [log in to unmask]
> Subject:      [TN] BGA dogbone...Can we get rid of it?
>
> <<File: PIC27414.PCX>>
>                (Embedded image moved to file: PIC27414.PCX)
>
> From: Dennis J Fall@TFT on 08/13/98 04:49 PM
>
>
> To:   [log in to unmask]
> cc:
> Subject:  BGA dogbone...Can we get rid of it?
>
> Is there a good way to plug vias so we can get rid of the dog bone pad?
>
> Dennis Fall                        P: 507-625-8445 x17
>
> Engineer                           F: 507-625-3523
>
> Thin Film Technology Corporation         mailto:[log in to unmask]
>
> 1980 Commerce Drive                http://www.thin-film.com
>
> North Mankato, MN 56003-1702
>

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