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August 1998

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Thu, 13 Aug 1998 21:55:48 EDT
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Graham Collins:
- Since my earlier post regarding which way the resistive element of a chip
resistor should face I received an e-mail copy of the J-STD-001C Proposal.  I
have copied the appropriate paragraph below:

"6.4.2.2 Devices with External Deposited Elements
Components with electrical elements deposited on an external surface (such as
chip resistors) shall be mounted with that surface away from the printed board
or substrate."

- The debate rages on about whether or not this would be considered a "defect"
since per J-STD-001 any condition not specifically listed by Table 11-1
(Hardware Defects) is not considered a "defect", and this condition is not
listed in Table 11-1.  Note that (in J-STD-001 jargon) using the word "shall"
means the requirement applies only to Class 3 Products.  If you would really
like to have the resistor chips mounted with the resistive element facing away
from the pwb surface then you need to put that requirement on your drawing.
Jim Moffitt

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