I have been posed a hypothetical question.  If flux dissolves a metallic
oxide into solution, can this oxide reappear as contamination at a later
point?  The actual case is a nickel "stain" on a ceramic substrate.  One
theory as to where the stain is coming from is that it is left behind after
flux residue removal.  Furthermore, the theory is that the flux can spray
this contaminant around due to the boiling process as it activates.  If
this is so, I really don't see why this isn't a major problem in all areas
of soldering.  I also can't see why it would only happen in this particular
application.  It would make my case easier however, if I had a more
complete understanding of the chemical process through which flux removes
the oxidation, and where the oxidation "goes".  Thanks for any help.

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