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August 1998

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From:
mmasters <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 13 Aug 1998 16:19:13 -0400
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Syed,

Thanks for the input.  Actually I was concerned with the protrusion of
the gold wire through the package mold.  What studies of reliability or
quality criteria exists for mosture following the wire to the leadframe
and die pad?  Does there exist an industry standard for this situation
for inspection and reliability?

Mike

sahmad wrote:
>
> If you mean the effect of the heat cycle in the mold: It may contribute to
> the intermetallic formation at the gold/other metal interface depending upon
> the temperature and time at temperature. Should mostly be insignificant.
> Gold wire should not be affected.
>
> If you mean the effect of encapsulant: The flow of encapsulant may sway the
> wires according to the wire orientation with respect to the flow, flow
> pressure and material flow viscosity. The flow of material may break a
> marginal gold wire contacts.  The encapsulant should not affect the gold
> wire. The flow may move the assembly away from its intended position,
> sometimes exposing wires at the top of the IC package.
>
> A good reference should be George Harmon's book on Wire Bonding.
>
> Syed.
>
>         -----Original Message-----
>         From:   mmasters [SMTP:[log in to unmask]]
>         Sent:   Thursday, August 13, 1998 10:50 AM
>         To:     [log in to unmask]
>         Subject:        [TN] Gold Wire Exposure
>
>         Greetings,
>
>         Has anyone done a study or have reliability data on the effects of
> gold
>         wire exposure through the mold on IC devices?  Perhaps a criteria
> has
>         been set somewhere as to the degree acceptable or rejectable?
>
>         Thanks
>
>         --
>         Mike Masters
>
>         Quality Assurance Engineering
>         Phone:  (919) 479-3771
>         FAX:    (919) 479-3328
>         Email:  [log in to unmask]
>
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--
Mike Masters
Quality Assurance Engineering
Phone:  (919) 479-3771
FAX:    (919) 479-3328
Email:  [log in to unmask]

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