TECHNET Archives

August 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 13 Aug 1998 11:32:41 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (67 lines)
If you mean the effect of the heat cycle in the mold: It may contribute to
the intermetallic formation at the gold/other metal interface depending upon
the temperature and time at temperature. Should mostly be insignificant.
Gold wire should not be affected.

If you mean the effect of encapsulant: The flow of encapsulant may sway the
wires according to the wire orientation with respect to the flow, flow
pressure and material flow viscosity. The flow of material may break a
marginal gold wire contacts.  The encapsulant should not affect the gold
wire. The flow may move the assembly away from its intended position,
sometimes exposing wires at the top of the IC package.

A good reference should be George Harmon's book on Wire Bonding.

Syed.

        -----Original Message-----
        From:   mmasters [SMTP:[log in to unmask]]
        Sent:   Thursday, August 13, 1998 10:50 AM
        To:     [log in to unmask]
        Subject:        [TN] Gold Wire Exposure

        Greetings,

        Has anyone done a study or have reliability data on the effects of
gold
        wire exposure through the mold on IC devices?  Perhaps a criteria
has
        been set somewhere as to the degree acceptable or rejectable?

        Thanks

        --
        Mike Masters

        Quality Assurance Engineering
        Phone:  (919) 479-3771
        FAX:    (919) 479-3328
        Email:  [log in to unmask]

        ################################################################
        TechNet E-Mail Forum provided as a free service by IPC using
LISTSERV 1.8c
        ################################################################
        To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
        To subscribe:   SUBSCRIBE TechNet <your full name>
        To unsubscribe:   SIGNOFF TechNet
        ################################################################
        Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
        For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
        ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2