Ryan,
       I am assuming that this is a two-row connector (three row will be a
     problem) and the connector can withstand reflow temps. If you have
     enough room on each side of the connector to print the required paste
     volume for each pin (the AMP or Phil Zarrow's ITM calculations will
     help), and your pin-to-hole ratio is tight enough, the protruding lead
     length is kept short, your paste is respondent to the PIH process, and
     your board is not too thick (if thicker then .062" you will have a
     harder time), also I've found solder mask (especially most LPI's) help
     the paste wick to the lead. Also, it helps if you're quality spec
     allows <100% filled hole.
       Once you've run the experiments and get the above correct, it is a
     very repeatable process, and worth the effort! Especially if these
     connectors are all you are waving, and you can eliminate wave solder
     on the board!!!
     Good luck!
     Jeff Hempton
     United Technology Electronic Controls


______________________________ Forward Header __________________________________
Subject: [TN] Fine Pitch Pin-In-Hole
Author:  Ryan Jennens <[log in to unmask]> at Internet
Date:    8/13/98 11:38 AM


Mornin all!

We are going to attempt a pin-in-hole (intrusive reflow, etc.) trial and
I am curious whether we will have more trouble with fine pitch (25 mil)
connectors than a larger pitch.  Obviously we will have to be more
careful,. but does pin-in-hole lend itself to problems with finer
pitch?  More so than wave soldering?  If we are getting two shorts (one
on each row of connectors, trailing two pins - need solder thieves
designed in, or air knife) per board with waving, will pin-in-hole
eliminate these.  I guess we will have more trouble getting enough paste
into the hole.  Let me know if the fine pitch will add headaches.
Thanks a lot!

Ryan Jennens
Phoenix Engineering Design

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