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August 1998

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Subject:
Gold Wire Exposure
From:
mmasters <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 13 Aug 1998 12:50:15 -0400
Content-Type:
text/plain
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text/plain (28 lines) 
Greetings,

Has anyone done a study or have reliability data on the effects of gold
wire exposure through the mold on IC devices?  Perhaps a criteria has
been set somewhere as to the degree acceptable or rejectable?

Thanks

--
Mike Masters

Quality Assurance Engineering
Phone:  (919) 479-3771
FAX:    (919) 479-3328
Email:  [log in to unmask]

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