Ryan,
        We have attempted PIH on fine pitch connectors and succeeded to
a limited extent. If it is a staggered row connector with 3-4 rows, you
will have difficulty getting volume since you can't really oversize your
apertures beyond the annular ring size without taking a chance of
bridging. You can try going to thicker stencil or 2 stencil process, or
possibly 2 pass squeegee print to drive more paste into hole. PIH of
fine pitch connectors works best with dual row header type where you can
overprint rectangular apertures away from centerline of rows. The other
issue is the potential of creating massive bridges if 'ol Shaky Bob is
on your line hand installing the connectors. If you're not doing ICT or
X-Ray after assembly to catch shorts, you can end up with quite a
problem. Bob Willis (one of the PIH mentors out there) has some good
info on his web site at:  www.bobwillis.co.uk

        Feel free to call me if I can provide any further info....

Mike McMonagle
PCA Process Supervisor
K*Tec Electronics
(281) 243-5639

> -----Original Message-----
> From: Ryan Jennens [SMTP:[log in to unmask]]
> Sent: Thursday, August 13, 1998 10:38 AM
> To:   [log in to unmask]
> Subject:      [TN] Fine Pitch Pin-In-Hole
>
> Mornin all!
>
> We are going to attempt a pin-in-hole (intrusive reflow, etc.) trial
> and
> I am curious whether we will have more trouble with fine pitch (25
> mil)
> connectors than a larger pitch.  Obviously we will have to be more
> careful,. but does pin-in-hole lend itself to problems with finer
> pitch?  More so than wave soldering?  If we are getting two shorts
> (one
> on each row of connectors, trailing two pins - need solder thieves
> designed in, or air knife) per board with waving, will pin-in-hole
> eliminate these.  I guess we will have more trouble getting enough
> paste
> into the hole.  Let me know if the fine pitch will add headaches.
> Thanks a lot!
>
> Ryan Jennens
> Phoenix Engineering Design
>
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