REGARDING           Aspect Ratio

What is the largest reasonable aspect ratio for 1, 1.5 and 2.0 mil plating (even consistant plating)?
It seems to make more sense to calculate the aspect ratio, based on the
secondary drill diameter ( somewhere around 5-6mils? ) instead of the finished
plated hole diameter...? And finally, what happens to the plated hole when the
pad-stack utilizes non-functional pads on all layers (say 8-10) except 2-3 solid
plane layers ( i.e., clearance diameters, but not "donuts" ). The material is
polyimide/glass. If the concern is resin concentration around holes, I can reduce
the planes to 1oz. The design is low current; I just need a good "webbed",
low-inductance return. Any comments on this subject is appreciated.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################