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August 1998

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Subject:
From:
"James A. Zeman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 3 Aug 1998 13:36:00 -0500
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Subject: fwd: [TN] PCB Delamination?
Conversation-id: 0A9EC535028E6BD1
000Importance: normal
200MCB-options: NNYNANAYA
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Re-sent-by: JIMZ @ OMNI-HQ (James A. Zeman)  ; on 03-Aug-1998 01:33:00
To: TECHNET @ SMTP [log in to unmask]
From: RTHOMPSO @ SMTP (Rick Thompson) [log in to unmask]
230Sender: RTHOMPSO @ SMTP (Rick Thompson)
  [log in to unmask]
Date: 03-Aug-98 12:33:00
Subject: [TN] PCB Delamination?
200o-nw-nb: 1, 1
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======== Original Message ========
Hi,

We recently had a run of PCBA's where round delaminated areas showed up in
the boards after convection reflow.  The areas are random and up to 2" in
diameter.  They weren't noticeable to visual inspection prior to running
through the oven.  I have 2 questions:

1. What might be the cause of this type of defect in the PCB?

2. Are there any independent test labs that could evaluate this and verify
the cause?

The reason for the 2nd question is that we're going back and forth with our
customer and their PCB supplier as to root cause and therefore, whose
responsibility it is.

Any feedback would be appreciated.


                Rick Thompson
                Ventura Electronics Assembly
                2665A Park Center Dr.
                Simi Valley, CA 93065

            [log in to unmask]

                (805) 584-9858 voice
                (805) 584-1529 fax

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======== Fwd by: James A. Zema ========
I have seen this happen as a result of moisture absorbtion by the laminate.

Some laminate types are more hygroscopic than others (cyanate ester for
example) and have special packaging, storage, and assembly requirements
(baking before assembly).

The laminate supplier should be able provide this information.

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