You might check JEDEC http://www.jedec.org , in particular Publication 95
which they have available on line. While I don't think it deals specifically
with the balls themselves, there are specifications for the BGA packages
which include ball dimensions, etc.


                Rick Thompson
                Ventura Electronics Assembly
                2665A Park Center Dr.
                Simi Valley, CA 93065

            [log in to unmask]

                (805) 584-9858 voice
                (805) 584-1529 fax

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask]
> Sent: Tuesday, August 11, 1998 1:03 PM
> To: [log in to unmask]
> Subject: [TN] BGA's
>
>
> I have searched the IPC data base for some kind
> of document which would help with acceptability
> of the solder balls themselves on a BGA component.
> Could not find one.
> Can anyone suggest a source for acceptability of
> the balls such as roundness, dia. tol.., etc..
> thanx...and regards
>
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