TECHNET Archives

August 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 11 Aug 1998 13:35:11 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (88 lines)
Or call George Harmon and let everyone know what he says.
Syed.

        -----Original Message-----
        From:   Brett Goldstein [SMTP:[log in to unmask]]
        Sent:   Tuesday, August 11, 1998 9:03 AM
        To:     [log in to unmask]
        Subject:        Re: [TN] Is Al to Ni wirebonding possible

                George Harmon has a brief section on bonding Al to Ni in his
Wire
        Bonding in Microelectronics (sorta the bible of wire bonding).  He
        states that the main difficulty in this system is the bondability of
        the system, and not its reliability (which is pretty good).  I have
        no experience bonding to this metallurgical system, but you may
        want to check out this reference.

        Brett Goldstein
        Mechanical engineer
        EVI, Inc.


        > Hi,
        > A certain vendor claims that thermosonic Al to Ni wirebonding is
possible. I am
        > looking for references to refute or support this claim. The
precise claim is
        > that on a flexible PCB constructed of:
        > Kapton:    25 um
        > Cu:        7-8 um
        > Ni:        1.0 um
        > Au:        0.2 um
        > that thermosonic wire bonding with Al wire results in a wire bond
to the Ni
        > layer. This claim was made after being confronted with the IPC
recommendation
        > that at least 1 um of Au is required.
        > If anyone could share his/her experience(s) on this subject, or,
better yet,
        > point me toward some authoritative reference(s), I would greatly
appreciate it.
        > TIA,
        > Rusty
        >
        >
        >
        >
        >
        > Rusty Boyd
        > OUHEP - http://oua4.nhn.ou.edu/
        > [log in to unmask]
        > office: (405)325-2890 x36316
        > office fax: (405)325-7557
        > home ph., fax and data: (405)447-5211
        > University of Oklahoma
        > Dept. of Physics and Astronomy
        > 440 W. Brooks
        > Norman, OK 73019
        >
        >

        ################################################################
        TechNet E-Mail Forum provided as a free service by IPC using
LISTSERV 1.8c
        ################################################################
        To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
        To subscribe:   SUBSCRIBE TechNet <your full name>
        To unsubscribe:   SIGNOFF TechNet
        ################################################################
        Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
        For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
        ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2