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August 1998

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Subject:
From:
Lenny Kurup <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 11 Aug 1998 10:20:02 -0400
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (79 lines)
Hello Rusty,

Consult "Wirebondability and solderability of various metallic finishes for
use in printed circuit assembly."  by Hillman, Bratin and Pavlov; 1996 IPC
Expo, S.J.

Results have shown peel strengths to be way below IPC wirebondability
requirements, for Al wire on elNi/ImAu. Au wire, however, passes the peel
strength requirement.


Regards,

Lenny Kurup
EMX Enterprises Ltd.
Markham, Ontario, Canada
905-475-8000 Ext 240.




On Tue, 11 Aug 1998, Rusty Boyd wrote:

> Hi,
> A certain vendor claims that thermosonic Al to Ni wirebonding is possible. I am
> looking for references to refute or support this claim. The precise claim is
> that on a flexible PCB constructed of:
> Kapton:    25 um
> Cu:        7-8 um
> Ni:        1.0 um
> Au:        0.2 um
> that thermosonic wire bonding with Al wire results in a wire bond to the Ni
> layer. This claim was made after being confronted with the IPC recommendation
> that at least 1 um of Au is required.
> If anyone could share his/her experience(s) on this subject, or, better yet,
> point me toward some authoritative reference(s), I would greatly appreciate it.
> TIA,
> Rusty
>
>
>
>
>
> Rusty Boyd
> OUHEP - http://oua4.nhn.ou.edu/
> [log in to unmask]
> office: (405)325-2890 x36316
> office fax: (405)325-7557
> home ph., fax and data: (405)447-5211
> University of Oklahoma
> Dept. of Physics and Astronomy
> 440 W. Brooks
> Norman, OK 73019
>
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