Hi,
A certain vendor claims that thermosonic Al to Ni wirebonding is possible. I am
looking for references to refute or support this claim. The precise claim is
that on a flexible PCB constructed of:
Kapton:    25 um
Cu:        7-8 um
Ni:        1.0 um
Au:        0.2 um
that thermosonic wire bonding with Al wire results in a wire bond to the Ni
layer. This claim was made after being confronted with the IPC recommendation
that at least 1 um of Au is required.
If anyone could share his/her experience(s) on this subject, or, better yet,
point me toward some authoritative reference(s), I would greatly appreciate it.
TIA,
Rusty





Rusty Boyd
OUHEP - http://oua4.nhn.ou.edu/
[log in to unmask]
office: (405)325-2890 x36316
office fax: (405)325-7557
home ph., fax and data: (405)447-5211
University of Oklahoma
Dept. of Physics and Astronomy
440 W. Brooks
Norman, OK 73019

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