IPC is looking for presenters for IPC Printed Circuits Expo '99
March 14-18, 1999
Long Beach Convention Center
Long Beach, CA
http://www.IPC.org/html/expocov.htm
The deadline for paper abstracts, August 17, 1998, is rapidly approaching. IPC
Printed Circuits Expo is the largest conference and exhibition in North America for
the printed circuit industry. As the 7,700 international attendees of 1998's event
can attest, there is no better forum for users, builders, and designers of printed
wiring boards.
HOW CAN YOU PARTICIPATE?
Present a Paper at the Technical Conference
Requirements: Provide print quality material for proceedings; an abstract submission
of 75-100 words; and a brief biography. Presentation materials and papers must be
noncommercial in nature. The author of the best technical paper will be awarded $1000
and a recognition plaque.
Abstracts and papers submitted should describe significant results from experiments,
emphasize new techniques, discuss trends of interest, and contain technical,
economic, or appropriate test data.
Papers focused on a company's product, rather than on the technology, will not be
accepted. Also, it is mandatory for all presenters to provide a publishable paper in
order to make an oral presentation. On-site time required: 30 minutes.
The deadline for abstract submission is August 17, 1998. The deadline for paper
submission is January 4, 1999.
Send an email to [log in to unmask] with your proposal TODAY and become a part of
IPC Printed Circuits Expo '99.
Why Should Your Company Be A Part of the Technical Program?
Developed and designed by the industry, for the industry, IPC Printed Circuits Expo
provides unparalleled visibility for you and your company. Your presence at the
event defines your company as an industry leader and enhances your professional
reputation. Distribution of the conference proceedings to over 1,500 companies and
individuals will help ensure that your paper is seen by key engineers and managers
throughout the industry.
IPC Printed Circuits Expo brings industry experts and newcomers together to help
shape the industry's response to the next set of manufacturing challenges. Your
participation contributes to the advancement of our industry. Industry leaders
writing new industry standards and guidelines will be able to refer to your findings.
Seize this opportunity through your participation as a speaker.
A Meaningful Venue
The technical conference is one of the primary attractions of IPC Printed Circuits
Expo. Over 80 papers covering areas from board design to materials to manufacture to
assembly technology will be presented. Some "hot topic" sessions reached over 200
attendees in standing room only crowds in 1998. Twelve-hundred professionals
attended 45 workshops and tutorials featuring topics from training to reliability to
chip scale packaging. Whether you choose to present an original paper, participate
on a panel, or educate the industry by leading a workshop or tutorial, your
contribution to IPC Printed Circuits Expo will be rewarding and an asset to the
industry.
Suggested Topics
NEXT GENERATION OF PWBs
Needs of OEMs
Plugged, Filled and/or Tented Vias
Reliability Comparisons
Integrated Components (i.e.: Transformers, LEDs, etc.)
HIGH DENSITY INTERCONNECTS
Microvias
Reliability/Failure Analysis
Techniques(assembly, rework/repair, etc.)
Infrastructure Development
Case Studies
ADVANCED PACKAGING
Ball Grid Array/Chip Scale
High-Density Packaging
Organic Chip Carrier Manufacturing
Flip Chip Reliability
PC BOARD FABRICATION
Direct Imaging
Fine Line Imaging
Use of Low Dielectric Materials
Horizontal Plating of Thin Cores
Periodic Pulse Reverse Plating
Direct Metallization
FLEX CIRCUITS
Flex Interposers
Flexural Endurance of Copper & Laminates
Market
DESIGN
Impact on Cost
High Speed Design
Design for Manufacture
Simulation of Fatigue
Design of Microvias/HDIS
ENVIRONMENTAL
Environmental Cost Accounting Tools
ISO 14001/Environmental Management Systems (EMS)
Environmentally-Friendly Manufacturing Materials/Methods
Lead-Free Solder & Finishes
MATERIALS
New/Alternative Resins
Inks, Pastes & Thick Films
Polymer vs. Process Interactions
Advances in Laminates, Prepregs & Other Materials
ASSEMBLY TECHNOLOGY
Conductive Adhesives
Flip Chip
Conformal Coatings
Alternative Surface Finishes for Fine Pitch
Lead-Free Solders
Materials for Conductive Paths
TEST AND INSPECTION
Bare Board Test on HDI
Boundary Scan
AOI
QUALITY AND RELIABILITY
Continuous Process Improvement
Plated Through-Hole Reliability
Solder Joint Reliability
Design of Experiments
IMPLEMENTING STANDARDS
IPC-4101, Materials
IPC-2510, GenCAM
IPC
2215 Sanders Road
Northbrook, IL 60062
tel 847.509.9700
fax 847.509.9798
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For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
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