For fine pitch devices 15.7 mils and small chips 0603 ,do we have any
IPC standard stating that what kind of surface leveliing /planarity
required for placement of FPDs and 0603/0402 chips.Even accurate
placement can go offline once the surface is not flat. the situation is
worse when we are trying to place 0603 components on glue dots.


Also, there are no. of options for HAl alternatives . We are comparing
gold immersion and OSPs.Our circuit boards are having fine pitch devices
extendable to 12 mils QFPs and 50/60 mils BGAs and chips down to 0402
package size.We also intend to implement No-Clean process in near
future.  We have limited experience with Au immersion/Ni electroless
and OSPs.
What are  views of experts who had some point of time decided course of
action. What you think we go for?We want to go for process where we do
not have to modify /readjust our current process based on water soluble
soldering. Pro and Cons?

Not to mention that I consider technet as my vital tool for problem
solving. I will appreciate comments on this asap as I am running out of
time and our process meeting is scheduled on Monady morning.

thanks

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