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August 1998

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Subject:
Flex Delamination Acceptiblilty
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 7 Aug 1998 04:59:13 -0700
Content-Type:
text/plain
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text/plain (20 lines) 
MIL-P-50884, or whatever the IPC version is now, speaks very clearly
about flex and rigid/flex delamination at the bare board level. It is no
different after assembly. Part of the qualification process was to
ensure acceptable quality and reliability, for quality conformance test
circuitry and circuits, as received and after thermal stress and shock.

Earl Moon

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