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August 1998

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Subject:
From:
Russ Winslow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Aug 1998 20:03:24 -0700
Content-Type:
text/plain
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text/plain (52 lines)
Rick,
Another method for attaching balls is SolderQuik preforms.  The solder balls
are embedded in water soluble paper.  You just apply flux to the package and
drop it in a fixture with the preform.  Reflow - then moisten the paper and
peel it away.  The web site is at  www.solderquik.com

I think what you are looking for is JEDEC Publication 95 which covers most
package dimension standards.  See drawing MO-151 for the plastic ball grid
array family.  Also see section 14 on BGA's.  The JEDEC specs are free of
charge and available on the internet.  What a great organization!  Follow
the link to Publication 95 then to MO-151.  http://www.jedec.org   You will
need adobe acrobat to read or print the pdf file.  You can get a free copy
there as well.

Hope this helps
[log in to unmask]

-----Original Message-----
From: Rick Thompson <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, August 05, 1998 11:00 AM
Subject: [TN] BGA Reballing


>I'm looking for information, recommendations, equipment, etc. for BGA
>reballing. Also, I've heard there is an IPC Spec dealing with BGA's, ball
>size, etc.  Does this exist, and if so, could somebody point me in the
right
>direction.
>
>                Rick Thompson
>                Ventura Electronics Assembly
>                2665A Park Center Dr.
>                Simi Valley, CA 93065
>
>            [log in to unmask]
>
>                (805) 584-9858 voice
>                (805) 584-1529 fax

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