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August 1998

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Aug 1998 16:45:12 -0500
Content-Type:
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J-STD-020 A Revision is out for ballot by JEDEC and IPC at this time.  The document
provides methodology to classify non-hermetic components to a level of sensitivity to
moisture.  The "class" of component will help the user to determine required process
steps to reduce occurance of "pop-corning"--cracking, delamination of the carriers,
etc.

JEDEC is through www.eia.org

EIAJ Profile info from JEDEC.

IPC/SMTA Electronics Assembly Expo
Technical Committee Meetings, Conference, Exhibits
Providence RI   October 24-29
More info at http://www.ipc.org

Jack Crawford, IPC Project Manager - Assembly
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask]      847-509-9700 x 393     fax 847-509-9798

>>> ETS <[log in to unmask]> 08/05/98 12:02PM >>>
Technet,

1. Can someone please tell me about J-std-020?
2. Does anyone know the web site address for Jedec?
3. Can someone please tell me about the EIAJ Profile?
4. Where can I get more info about EIAJ profile?

Any help is much appreciative.

Best Regards,

Scott McMasters
Process Engineer
ETS, LLC

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