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August 1998

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Subject:
Bubbles from conformally coated board
From:
Lum Wee Mei <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 1 Sep 1998 10:26:42 +0800
Content-Type:
text/plain
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text/plain (22 lines) 
The test engineer came back to us to complain that bubbles are found
along the edge of the power modules after going through the temperature
cycling tests. This problems are found on both coated boards. The power
modules are mounted completely flushed onto the board and subject to
conformal coating using the diping method. The coated board undergo QC
to ensure all components are completely coated, inlcuding the edges
around the modules.

What could be the problem?

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