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August 1998

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Subject:
From:
David Bergman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 3 Aug 1998 08:05:58 -0500
Content-Type:
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IPC is in the process of developing a computer based training program (CDRom) to
IPC-A-600.  To visualize some of the defects described in the document, we are
looking for some samples to photograph.  While I'm sure no one out there has made
these types of defects before ;-), maybe they know a friend who has.  Any help you
can provide would be much appreciated.  Boards can be returned after they have been
photographed.

If you can help, please reply to [log in to unmask]

 1. Waves / Wrinkles / Ripples in Solder Mask -
samples of both tin lead fused and SMOBC baords with waves / wrinkles /
ripples in solder mask- (several samples each)
2. Same as above - over conductive pattern
3.  Same as above - not above conductive patterns
4. Wave / Wrinkle or ripple bridging across conductors
5. Wave or wrinkle that reduces solder mask thickness (thins down the mask)
6. LPI Solder Mask wrinkle - caused by stutter in the wave
7. Very thick solder mask - caused by wave / wrinkle, etc.  where a chip
component will sit - potentially causing tombstoning during soldering
8. Soda Strawing
9. Samples of soda strawing on SMOBC and tin-lead fused boards
10. Very long soda straw void
11. Some sort of contamination trapped in Soda Straw Void (like flux or fusing fluid
- something visible?)
12. Slivers along the edges of gold plated tabs (from overetching)  - these
slivers need to peel up during a tape adhesion test.




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David W. Bergman CAE
Vice President of Technical Programs
IPC
2215 Sanders Road
Northbrook, IL  60062-6135
P 847-509-9700 x340
F 847-509-9798
email       [log in to unmask]
IPC's website     www.ipc.org
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