My thanks to everyone who answered my query about embedded components, and
who forwarded me information about how to sign up for this list.

Using the information you sent me (when compared with the original
Japanese), I can now assume that what I am dealing with is hybrid
components, which may or may not be embedded into the PWB itself. As a
relative newcomer to the packaging field (I used to be a semiconductor
engineer in years past)  I will have to follow the leads you have so kindly
provided before I understand totally what a "hybrid component" is -- because
it can be embedded into the interconnecting substrate itself, it is
certainly not the BiCMOS-type device I tend to think of when I hear the term
"hybrid device."

I gather from Dan Brandler that "integrated passive devices" are integrated
into (or onto) the semiconductor die itself, so I don't think that this is
what I am looking at. Perhaps the term "integral hybrid" would be best
suited.

I can relate well with your complaints about liberal arts Japanese majors
who think that they can translate technical materials, or about Japanese
engineers who think they can translate into English. Those of us who have
left engineering to be translators are trying to do something about these
other guys who give us a bad name! Even engineers have problems with
translation, though -- although as an engineer I understand most of the
technical materials I read in Japanese, I haven't actually worked in the
packaging field, so I don't know how you guys talk. I am looking forward to
reading your discussions on this mail list so I can study the words you use!

Warren

Warren

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