Hello again fellow 'Techies',
We have an interesting scenario which has raised some questions. We have an
application in which we are processing some panels through direct
metalization, after they have been selectively gold plated. After removing
the conductive colloid via micro-etch, we noticed significant Gold/Nickel
adhesion problems. At sporadic  locations throughout the panels, the Ni/Au
was completely peeling away. The Au to Ni adhesion appears intact. However,
the Ni to Cu adhesion is were the problem appears to be. We are
interpreting this as a cleanliness issue prior to plating. We find it
difficult to believe that there is something in the direct metalization
process that is attacking the Ni/Au and causing it to peel away from the
Cu. Does anyone have any previous experience with this scenario? Does
anyone know of any reason why the direct metalization process would attack
the adhesion properties of the Ni to Cu?

Thanks in advance...

Brian Guidi
Methods Engineer
Teledyne Electronic Technologies
Printed Circuit Technology Division

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