Warren Smith asked:

>I have found this newsgroup in a search of the internet, but I am not sure
>how to join it. Can someone send me some information about how to join?

Greetings. Very simple. See text at the bottom of every mail list message
sent by this server.

>On a more technical front, I am currently translating from Japanese into
>English some materials on the PWB industry. There is a term that has come up
>several times that translates, literally, into "compound component" or
>"composite component," referring, apparently, to a chip that contains, for
>example, 4 passive elements with 8 pins. There are also references to
>building these components into the boards themselves through a thick film or
>thin film process.

I can tell you, literal translations will often work out comically. I used
to work for Fujitsu here in Texas. We referred to this special literature
as "Janglish". It comes from using bilingual liberal arts grads to
translate technical documents into English with bizarre effect.

>Can someone a) tell me the correct term by which to refer to these
>components, and b) refer me to a web page that describes these in more
>detail?

I would guess you refer to "hybrid" components. Now that chip on board is
becoming more common, these hybrids can have much higher levels of
functionality.

You may also be interested in methods of building PWB's with embedded
components.

Regarding "buried capacitance" (a trademarked term) which is generically
referred to as embedded capacitance; see http://www.hadco.com/products.htm
they bought Zycon who had a patent on it. They also have a method called
"Emcap" which uses a high DK material between planes to produce greated
capacitance.

regards,


Jerry Cupples
Interphase Corporation
Dallas, TX USA
http://www.iphase.com

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