In a message dated 8/27/98 5:57:29 PM Pacific Daylight Time,
[log in to unmask] writes:

<< Steve,

 I tried the burnt finger trick and was able to remove .006 inches in 30
 seconds in the solder pot.  The resistor I dipped had a .047 diameter copper
 lead before and .041 diameter after.  I should think your component could
 withstand an extra 15 second temp cycle (or less).  Shake them as hard as
 you can while immersed in the solder bath.  If your worried about it just
 find a way to heat sink the part or better yet drill some holes in a sheet
 of unsolderable metal (oxidize some stainless) (titanium is best) then do
 several at one time.  Most of the heat will transfer to the sheet metal and
 the component temperature will be significantly reduced.  Don't forget the
 copper is ending up in your solder bath.

 Good Luck (I never did understand that square peg in the round hole thing)
 Too much lead in my blood.

 Russ (burnt fingers) Winslow>>

Hey there Russ!

     What a guy!! Prototyped that for me! I thought about trying it when I
read your suggestion a couple of days ago, but I guess I weenied out and went
for the wussy way. I got some pin recepticals and waved those in the board,
then put the diodes in the recepticals. BUT, I've just filed your little trick
in the ol' non-volatile memory banks so I can recall it when I need
too...thanks Russ!!

      Say, I got a chance to go down to SMI today and I stopped by your
company's booth, that BGA reballing deal that you guys sell is really pretty
slick! I've seen the advertisements in the 'zines, but this was the first time
I got to see it first hand. If any of you other "Techies" out there haven't
seen their BGA re-balling kit, check it out, it really makes things
simple...you don't need solder paste, or those munchkin stencils, and you
don't have a bunch of balls rolling all over that you gotta keep track of. But
I gotta ask you Russ (with my tongue in my cheek again), where did you guys
pick-up that high-tech reflow oven you were using at the show? And when was
the last time that thing was cal'ed? hehehe...

The reason I was chuckling,  was that they were reballing BGA's live at the
show, and were using a counter-top convection Bagle-toaster oven to reflow the
balls on the BGA...but hey, it worked!! Good testament to how simple it is...

-Steve Gregory-

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