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August 1998

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From:
Kevin Stokes <[log in to unmask]>
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Date:
Thu, 6 Aug 1998 13:19:28 -0400
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Hey everyone,

My company is currently working on implementing BGA's into
our new product design.  As part of that project, we have developed
a team to develop our SMT process to handle BGA's.  We produced
our first boards the other day and analyzed them with X-ray
equipment.  We found that we had two problems.  The first problem
was that we had one short (out of 6 388 BGA's and 2 256 BGA's)
and another pair of balls that looked like they were shorted but pulled
apart before they solidified.  Does anyone have suggestions of causes
other than too much solder paste?

The second problem is a little more perplexing.  Most of the balls on
the outside corner of the 388 packages were misshapen.  They were
oblong or tear shaped with no apparent trend in their orientation.
Does anyone have any experience or ideas about this phenomenon?

Thanks in advance,

Kevin

--------------------------------------------------------------------------------
Kevin Stokes                                               Acu-Rite Incorporated
Reliability Supervisor                                           1 Precision Way
Phone:  (716) 661-1836                                       Jamestown, NY 14701
FAX:  (716) 661- 1793

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