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August 1998

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Subject:
From:
Rick Thompson <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Rick Thompson" <[log in to unmask]>
Date:
Thu, 27 Aug 1998 13:49:11 -0700
Content-Type:
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text/plain (40 lines)
I'm looking for feedback on what some of you are specifying for stencils for
BGA and Micro BGA packages. Material, thickness, aperture size, etc.  The
components we're looking at are standard BGA, 1.27mm pitch, .75mm balls and
Micro BGA at .8mm pitch with .5mm balls.

Thanks in advance.

                Rick Thompson
                Ventura Electronics Assembly
                2665A Park Center Dr.
                Simi Valley, CA 93065

            [log in to unmask]

                (805) 584-9858 voice
                (805) 584-1529 fax

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