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August 1998

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Subject:
From:
David P Bishir II <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 27 Aug 1998 11:01:34 -0500
Content-Type:
text/plain
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text/plain (73 lines)
Neal,
We use nitrogen storage cabinets for bulk storage and try to turn FIFO, WIP
on the mfg. floor ASAP. Packages on the floor are sealed immediately after
needed quantities of components are removed using nitrogen and a freshly
baked desiccant bag. We track the cumulative open time of the package with
a small label on the package. If the open cumulative time exceeds 44 hours,
then we'll bake the components, but this rarely happens. The key is to keep
WIP reduced, insure FIFO is implemented and keep turning the inventory.
Sounds like a big deal, but really isn't. Most of this is done in off-line
setups that are operating in parallel with the in process smd line. Hope
this helps!!

Dave Bishir II




"Neal W Driscoll" <[log in to unmask]> on 08/27/98 08:57:31 AM

Please respond to "\"TechNet E-Mail Forum.\" <[log in to unmask]>,        Neal
      W Driscoll" <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: David P Bishir II/HDC)
Subject:  [TN] Handling Moisture Sensitive Components




Technetters,

This is a follow up to an earlier e-mail I sent out concerning the handling
of moisture sensitive components.  I have gotten some information
concerning the issue and I am now trying to find out what processes/methods
other electronic manufactures are using to address handling moisture
sensitive components from receiving, to the stock room, to the
manufacturing floor (SMD area).  Are people strictly re-packaging and
issuing the parts?  Are nitrogen storage cabinets being used?  Are people
skipping all handling precautions and just baking prior to SMD?  What are
others doing????


Any information would be appreciated.  Thanks.


Neal Driscoll

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