TECHNET Archives

August 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Bill Davis <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Bill Davis" <[log in to unmask]>
Date:
Thu, 27 Aug 1998 07:50:05 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (74 lines)
Try methylene chloride to remove the markings; xylene and toulene will
also remove some paints. If the parts are laser etched I'm not aware of
any chemical that will remove the etching without attacking the package.
The package material is a filled novalac resin-the filler is typically
70-90%, depending on where the parts are assembled, and silicon diox is
the filler of choice.

> *********************************
> Bill Davis, Ph.D.
> Diamond Multimedia Systems
> Senior Scientist
> Tel. 408.325.7868
> Cell. 408.888.5650
> e-mail: [log in to unmask]
> ********************************
>
>
>
> -----Original Message-----
> From: Edwin Maximo [SMTP:[log in to unmask]]
> Sent: Thursday, August 27, 1998 2:20 AM
> To:   [log in to unmask]
> Subject:      [TN] ic package
>
> Hi there!
> Can someone tell me what type of material does most IC package are
> made of. I've been looking for some ways on how can the top marking
> of ICs can be removed or covered. Any inputs will be appreciated.
> Thanks in advanced.
>
> Regards,
> Edwin Maximo
> Electronic Assemblies Inc.
> Philippines
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
> 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2