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August 1998

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Subject:
From:
Bill Davis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 27 Aug 1998 07:50:46 -0700
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try the underfills used in the flipchip industry

> -----Original Message-----
> From: Lage, Bruce [SMTP:[log in to unmask]]
> Sent: Wednesday, August 26, 1998 3:53 PM
> To:   [log in to unmask]
> Subject:      [TN] BGA Underfill
>
> Does anybody have any recommendations and/or experience with adhesive
> underfills to decrease the strain and increase the durability of CBGA
> and PBGA solder joints
>
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