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August 1998

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Subject:
From:
"Collins, Graham" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "Collins, Graham" <[log in to unmask]>
Date:
Thu, 27 Aug 1998 11:02:12 -0300
Content-Type:
text/plain
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text/plain (79 lines)
Neal
We typically do not do a receiving inspection on moisture sensitive parts
(unless previous history says we should), the parts are issued to the line
in original packaging.  If not all used after opening we store them in a
nitrogen cabinet.
The other twist we have is that since we build small batches we often end up
buying parts from distributors who may or may not have opened the packaging
to split up lots of parts.  In that case we typically bake before use and
again store unused parts in the cabinet.

regards,

Graham Collins
Process Engineer
Litton Systems Canada
(902) 873-2000 extension 215

-----Original Message-----
From: Neal W Driscoll [mailto:[log in to unmask]]
Sent: Thursday, August 27, 1998 10:58 AM
To: [log in to unmask]
Subject: [TN] Handling Moisture Sensitive Components


Technetters,

This is a follow up to an earlier e-mail I sent out concerning the handling
of moisture sensitive components.  I have gotten some information
concerning the issue and I am now trying to find out what processes/methods
other electronic manufactures are using to address handling moisture
sensitive components from receiving, to the stock room, to the
manufacturing floor (SMD area).  Are people strictly re-packaging and
issuing the parts?  Are nitrogen storage cabinets being used?  Are people
skipping all handling precautions and just baking prior to SMD?  What are
others doing????


Any information would be appreciated.  Thanks.


Neal Driscoll

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