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August 1998

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Subject:
Handling Moisture Sensitive Components
From:
Neal W Driscoll <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Neal W Driscoll" <[log in to unmask]>
Date:
Thu, 27 Aug 1998 09:57:31 -0400
Content-Type:
text/plain
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Technetters,

This is a follow up to an earlier e-mail I sent out concerning the handling
of moisture sensitive components.  I have gotten some information
concerning the issue and I am now trying to find out what processes/methods
other electronic manufactures are using to address handling moisture
sensitive components from receiving, to the stock room, to the
manufacturing floor (SMD area).  Are people strictly re-packaging and
issuing the parts?  Are nitrogen storage cabinets being used?  Are people
skipping all handling precautions and just baking prior to SMD?  What are
others doing????


Any information would be appreciated.  Thanks.


Neal Driscoll

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