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August 1998

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Subject:
From:
"Kelly M. Schriver" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 20 Aug 1998 13:51:24 -0500
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Good morning all -

Does anyone have experience assembling fine pitch, high density surface mount
CCAs with the Omikron white tin finish, rather than HASL?

If so, can you give me some insight on how the material has performed?

I would also like to hear from any multilayer circuit board fabricators who
have this process on line, and their experiences on the stability of the
process.

Regards - Kelly

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