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August 1998

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Bev Christian" <[log in to unmask]>
Date:
Fri, 28 Aug 1998 19:30:13 -0400
Content-Type:
text/plain
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text/plain (70 lines)
Mark,
        I don't understand.  If you are going to: "break the solder joint of
individual fine pitch leads when it appears to be a poor joint from visual
inspection", how is this not destructive??

        regards,
        Bev Christian
        Nortel
> ----------
> From:         Mark Wythes[SMTP:[log in to unmask]]
> Sent:         Friday, August 28, 1998 5:14 PM
> To:   [log in to unmask]
> Subject:      [TN] SMT gull wing solder joint force test?
>
> Are there any standards for testing the solder joint
> mechanical strength for surface mount gull wing lead?
>
> We are wondering if there are any standards and test
> methods for the force required to break the solder joint of
> individual fine pitch leads when it appears to be a poor joint
> from visual inspection. We would like to confirm a poor joint
> through some simple non-destructive test in our receiving
> inspection area when receiving assembled PCB's from our
> board assembly supplier. In other words, this is finished
> product. Our idea was to use a force gauge pushing on the
> side of the lead and measuring force to break the joint. But
> we don't know what is acceptable without a lot of testing. So,
> would this be a valid test of a solder joint, are there
> established methods for a test like this, and are there
> acceptable ranges of force for different types of SMT
> packages?
>
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