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Subject:	Re: Solder Bridges under BGAs
From:	Craig Smith <[log in to unmask]>
Reply To:	[log in to unmask]
Date:	Wed, 26 Aug 1998 18:44:56 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (41 lines)

Nick,
   Did you use the same stencil for the OSP and HASL boards? What size and shape are the stencil apertures
for the BGA?  Might the lack of additional solder on the OSP boards be why you didn't have shorts vs. the
additional volume of solder on the pads from HASL?

Craig D. Smith
Process Eng. - Paradyne Corp.

Nick Nicolaides wrote:

> Hi!
> Our contract manufacturer employs HASL for the PCBs'. Previous to this the
> CM was using OSP (Entek). He stated he has better quality using HASL PCBs.
> However we are now experiencing some solder bridging under the BGA's. He is
> using HASL,  WS 609 solder paste (6 mils), and what the solder bumps are on
> the BGAs. This appears to be acceptable but why the solder bridging under
> the BGA. What are your thoughts!
>
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