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August 1998

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TechNet <[log in to unmask]>
Subject:
Flex Delamination Acceptiblilty
From:
Earl Moon <[log in to unmask]>
Date:
Fri, 7 Aug 1998 04:59:13 -0700
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"TechNet E-Mail Forum." <[log in to unmask]>, Earl Moon <[log in to unmask]>
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MIL-P-50884, or whatever the IPC version is now, speaks very clearly
about flex and rigid/flex delamination at the bare board level. It is no
different after assembly. Part of the qualification process was to
ensure acceptable quality and reliability, for quality conformance test
circuitry and circuits, as received and after thermal stress and shock.

Earl Moon

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