Phil
The cynic in me has to ask how the heck you would rework this type of board?
The issue of lead is also different from things like acid rain (or freon!)
in that the acid rain problem doesn't tend to happen where the pollution
originates, whereas if I am behaving badly with lead it is in my own
backyard. Unless the commotion is to do with the disposal of electronics
after their useful life - in which case, as has been observed, we are not
the worst offenders - look at your car battery...
regards,
Graham Collins
Process Engineer
Litton Systems Canada
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Thursday, August 27, 1998 8:30 AM
To: [log in to unmask]
Subject: Re: [TN] European Lead Ban
Phil,
The glue parts, laser drilling, sputtering coating vias sounds interesting,
but won't you still be limited to a single sided board?
Also, a little more trivia (I'm full of the stuff). I'm afraid that a lot
of the former acid rain problems in Scandinavia were due to Canada. The
Inco smelter in Sudbury used to be the single largest, man-made point source
of acid rain precursors in the world until they put modern acid scrubbers on
the Super Stack (its real name) sometime in the seventies. Also, as someone
else in this forum pointed out, the acid rain in the Sudbury area was so bad
before the Super Stack that the immediate area was so denuded of vegetation
that the Apollo astronauts used that area for their training to simulate
their moon walks!
regards,
Bev Christian
Nortel
> ----------
> From: Phil Hersey[SMTP:[log in to unmask]]
> Sent: Wednesday, August 26, 1998 5:04 PM
> To: [log in to unmask]
> Subject: [TN] European Lead Ban
>
> Just for fun I'll throw this in... there is an alternative to both epoxy
> and solder for electrical connection of IC's to printed circuit boards.
> SMT, CSP, or Flipchip actives are glued pads/connections down onto a PCB.
> It doesn't matter if the glue covers the connection area or not. Then
> vias are laser ablated from the backside of the board to each metal
> connection pad (laser stops at higher melting metal). Electrical
> connection is made by sputtering of metal through the holes to the pads in
> large batch chambers. No solder, no epoxy and chip adhesive layer can act
> as a TCE interposer.
>
> Down with lead.
>
> Phil Hersey
>
> P.S. Europeans have somewhat of a head start on us in experiencing the
> effects of pollution in their small highly populated continent. A
> Norwegian customer tells me all the lakes there are dead due to acid rain
> from England.
>
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