DESIGNERCOUNCIL Archives

August 1998

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Subject:
Re: 20 mil pitch part pad pattern
From:
"<Tim Easterling>" <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Mon, 3 Aug 1998 13:34:43 -0500
Content-Type:
text/plain
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text/plain (27 lines) 
I would not use that Land Pattern without consulting my process engineer.
A 4 mil space could create solder bridging during solder paste and reflow
application. Unless, you are planning an alternate process.

I know this does not answer your question, but just a word of caution.



Tim Easterling
Cadd Manager Commercial Engineering
Technology Division
SCI Systems Inc.
(256)882-4426 (ph)
(256)882-4305 (fx)

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