Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Sat, 15 Aug 1998 11:38:22 -0400 |
Content-Type: | text/plain |
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The best way that I can think of is to use microvia technology. Put a
microvia in the BGA solderpad
and move the "dogbone" to layer 2 where it won't be a problem.
Steph
*********************************************************
Stephan Meschter [log in to unmask]
Lockheed Martin Control Systems Phone :(607)770-2332
600 Main Street, MD R52F FAX :(607)770-2056
Johnson City, NY 13790-1888 MARCALL: 8 * 255-2332
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> ----------
> From: [log in to unmask][SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;[log in to unmask]
> Sent: Thursday, August 13, 1998 5:49 PM
> To: [log in to unmask]
> Subject: [TN] BGA dogbone...Can we get rid of it?
>
> <<File: PIC27414.PCX>>
> (Embedded image moved to file: PIC27414.PCX)
>
> From: Dennis J Fall@TFT on 08/13/98 04:49 PM
>
>
> To: [log in to unmask]
> cc:
> Subject: BGA dogbone...Can we get rid of it?
>
> Is there a good way to plug vias so we can get rid of the dog bone pad?
>
> Dennis Fall P: 507-625-8445 x17
>
> Engineer F: 507-625-3523
>
> Thin Film Technology Corporation mailto:[log in to unmask]
>
> 1980 Commerce Drive http://www.thin-film.com
>
> North Mankato, MN 56003-1702
>
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